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Sublimation - Conde Systems - 27 Years Expert Experience
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DynaSub Device Cover Inserts (iPad, iPhone, Nook, Fire) for DS021SG

Required Accessories

Heat Tape

Paper

DyeTrans Multi-Purpose or TexPrint

OUR INSTRUCTIONS ARE BASED ON USING A DK20S, DK3110 AND/OR A COUNTER TOP CONVECTION OVEN. TIMES AND TEMPERATURES WILL VARY DEPENDING ON WHICH EQUIPMENT YOU USE.


SECONDS

385
DEGREES

LIGHT
PRESSURE

Hover transfer under open heat press for 10 seconds to dry excess moisture.

Remove peel coat from inserts.If bottom platen is cold, begin by preheating for 15 seconds.

1) Lay protective paper on heat press platen.

2) Remove protective film from insert.

3) Lay insert substrate face-down on transfer. Use heat tape or Pro Spray to keep it in place.

4) Add a piece protective paper over your transfer and insert.

5) Press. Add 2-3 seconds for each additional insert imaged at the same time.

NOTE: If you should see a void in the provided glue layer, add a drop of Super Glue to those areas prior to assembly of the product.

NOTE: When adding the insert to a phone case, before you remove the protective paper covering the pre-glued area, start at one side and smooth out any air that may be trapped under the glue strip. Then you may remove the paper and insert the newly decorated insert. This will make the insert more secure.

If you should see small watermarks after imaging, try using less pressure. Another method is to press it before removing the peel coat, the image will transfer through the plastic without the watermarks.

Updated: February 19, 2016

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